Advanced Fine Pitch Solutions

A pioneer in the ultra-fine pitch wire bonding realm, we launched the 30 μm bond pad pitch bonding capability.? Key enabling factor is ASMPT’s digital control bond head technology with advanced low impact process control features.

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Wire Bonding

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World’s Best Fine Pitch Bonding Capability

  • 30μm BPP
  • Bond placement: 2μm @ 3σ
  • Extensive field knowledge & reliability proven solutions for:
    • 2N wires
    • Ultra low-k, 45nm technology dies

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?Enabling factors

  • Innovation in core module design
  • Extensive CAE Modelling & experimental validations

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